![Micromachines | Free Full-Text | Effects of Process Parameters on Bond Properties of Ag-2.35Au-0.7Pd-0.2Pt-0.1Cu Alloy Wire Micromachines | Free Full-Text | Effects of Process Parameters on Bond Properties of Ag-2.35Au-0.7Pd-0.2Pt-0.1Cu Alloy Wire](https://www.mdpi.com/micromachines/micromachines-14-01587/article_deploy/html/images/micromachines-14-01587-g002-550.jpg)
Micromachines | Free Full-Text | Effects of Process Parameters on Bond Properties of Ag-2.35Au-0.7Pd-0.2Pt-0.1Cu Alloy Wire
![Wire Pull Test The wire pull test is performed using a Pull Tester (BT-14, DAGE 2400 PC, DAGE 4000) and a Pull Hook (performed by placing the hook 90° - ppt download Wire Pull Test The wire pull test is performed using a Pull Tester (BT-14, DAGE 2400 PC, DAGE 4000) and a Pull Hook (performed by placing the hook 90° - ppt download](https://slideplayer.com/11710687/47/images/slide_1.jpg)
Wire Pull Test The wire pull test is performed using a Pull Tester (BT-14, DAGE 2400 PC, DAGE 4000) and a Pull Hook (performed by placing the hook 90° - ppt download
![Figure 3 from Improvement of the second bond strength in copper wire bonding on pre-plated leadframe | Semantic Scholar Figure 3 from Improvement of the second bond strength in copper wire bonding on pre-plated leadframe | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/7c909ec5fa44bd8a178ab14dc52b0cd3e4f688f1/2-Figure2-1.png)